Integrated control module for communication system on a chip for silicon photonics

ABSTRACT

In an example, an integrated system-on-chip device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. A control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority to U.S.application Ser. No. 14/265,185, filed Apr. 29, 2014, which claimspriority to U.S. Provisional Application No. 61/845,326, filed Jul. 11,2013, commonly assigned and incorporated by reference herein for allpurposes.

BACKGROUND OF THE INVENTION

The present invention relates to telecommunication techniques. Moreparticularly, the present invention provides an integrated electricaloptics multiple chip module and methods.

Over the last few decades, the use of communication networks exploded.In the early days Internet, popular applications were limited to emails,bulletin board, and mostly informational and text-based web pagesurfing, and the amount of data transferred was usually relativelysmall. Today, Internet and mobile applications demand a huge amount ofbandwidth for transferring photo, video, music, and other multimediafiles. For example, a social network like Facebook processes more than500 TB of data daily. With such high demands on data and data transfer,existing data communication systems need to be improved to address theseneeds.

Over the past, there have been many types of communication systems andmethods. Unfortunately, they have been inadequate for variousapplications. Therefore, improved communication systems and methods aredesired.

BRIEF SUMMARY OF THE INVENTION

The present invention relates to telecommunication techniques. Morespecifically, various embodiments of the present invention provide acommunication interface that is configured to transfer data at highbandwidth over optical communication networks. In certain embodiments,the communication interface is used by various devices, such as spineswitches and leaf switches, within a spine-leaf network architecture,which allows large amount of data to be shared among servers.

In modern electrical interconnect systems, high-speed serial links havereplaced parallel data buses, and serial link speed is rapidlyincreasing due to the evolution of CMOS technology. Internet bandwidthdoubles almost every two years following Moore's Law. But Moore's Law iscoming to an end in the next decade. Standard CMOS silicon transistorswill stop scaling around 5 nm. And the internet bandwidth increasing dueto process scaling will plateau. But Internet and mobile applicationscontinuously demand a huge amount of bandwidth for transferring photo,video, music, and other multimedia files. This disclosure describestechniques and methods to improve the communication bandwidth beyondMoore's law.

Serial link performance is limited by the channel electrical bandwidthand the electronic components. In order to resolve the inter-symbolinterference (ISI) problems caused by bandwidth limitations, we need tobring all electrical components as close as possible to reduce thedistance or channel length among them. Stacking chips into so-called 3-DICs promises a one-time boost in their capabilities, but it's veryexpensive. Another way to achieve this goal in this disclosure is to usemultiple chip module technology.

In an example, an alternative method to increase the bandwidth is tomove the optical devices close to electrical device. Silicon photonicsis an important technology for moving optics closer to silicon. In thispatent application, we will disclose a high speed electrical opticsmultiple chip module device to achieve terabits per second speed, aswell as variations thereof.

In an alternative example, the present invention includes an integratedsystem-on chip-device. The device is configured on a single siliconsubstrate member. The device has a data input/output interface providedon the substrate member and configured for a predefined data rate andprotocol. The device has an input/output block provided on the substratemember and coupled to the data input/output interface. In an example,the input/output block comprises a Serializer/Deserializer (SerDes)block, a clock data recovery (CDR) block, a compensation block, and anequalizer block, among others. The device has a signal processing blockprovided on the substrate member and coupled to the input/output block.In an example, the signal processing block is configured to theinput/output block using a bi-direction bus in an intermediary protocol.The device has a driver module provided on the substrate member andcoupled to the signal processing block. In an example, the driver moduleis coupled to the signal processing blocking using a uni-directionalmulti-lane bus. In an example, the device has a driver interfaceprovided on the substrate member and coupled to the driver module andconfigured to be coupled to a silicon photonics device. In an example,the driver interface is configured to transmit output data in either anamplitude modulation format or a combination of phase/amplitudemodulation format or a phase modulation format. In an example, thedevice has a receiver module comprising a transimpedance amplifier (TIA)block provided on the substrate member and to be coupled to the siliconphotonics device using predefined modulation format, and configured tothe digital signal processing block to communicate information to theinput output block for transmission through the data input/outputinterface. In an example, the device has a communication block providedon the substrate member and operably coupled to the input/output block,the digital signal processing block, the driver block, and the receiverblock, among others. The device has a communication interface coupled tothe communication block. The device has a control block provided on thesubstrate member and coupled to the communication block.

In an example, the signal processing block comprises a forward errorcorrection (FEC) block, a digital signal processing block, a framingblock, a protocol block, and a redundancy block, among others. Thedriver module is selected from a current drive or a voltage driver in anexample. In an example, the driver module is a differential driver orthe like. In an example, the silicon photonics device is selected froman electro absorption modulator (EAM) or electro optic modulator (EOM),or a Mach-Zehnder modulator (MZM). In an example, the amplifiedmodulation format is selected from non-return to zero (NRZ) format orpulse amplitude modulation (PAM) format. In an example, the phasemodulation format is selected from binary phase shift keying (BPSK) ornPSK. In an example, the phase/amplitude modulation is quad amplitudemodulation (QAM). In an example, the silicon photonic device isconfigured to convert the output data into an output transport data in awave division multiplexed (WDM) signal. In an example, the control blockis configured to initiate a laser bias or a modulator bias. In anexample, the control block is configured for laser bias and powercontrol of the silicon photonics device. In an example, the controlblock is configured with a thermal tuning or carrier tuning device eachof which is configured on the silicon photonics device. In an example,the SerDes block is configured to convert a first data stream of N intoa second data stream of M.

In an example, the invention provides an integrated system-on-chipdevice. The device has a single silicon substrate member and a datainput/output interface provided on the substrate member and configuredfor a predefined data rate and protocol. In an example, the device hasan input/output block provided on the substrate member and coupled tothe data input/output interface. The input/output block comprises aSerDes block, a CDR block, a compensation block, and an equalizer block,among others. The device has a signal processing block provided on thesubstrate member and coupled to the input/output block. In an example,the signal processing block is configured to the input/output blockusing a bi-direction bus in an intermediary protocol. In an example, thedevice has a driver module provided on the substrate member and coupledto the signal processing block. The driver module is coupled to thesignal processing blocking using a uni-directional multi-lane bus. In anexample, the device has a driver interface provided on the substratemember and coupled to the driver module and configured to be coupled toa silicon photonics device. The driver interface is configured totransmit output data in either an amplitude modulation format or acombination of phase/amplitude modulation format or a phase modulationformat in an example. The device has a receiver module comprising a TIAblock provided on the substrate member and to be coupled to the siliconphotonics device using predefined modulation format, and configured tothe digital signal processing block to communicate information to theinput output block for transmission through the data input/outputinterface. In an example, the device has a communication block providedon the substrate member and operably coupled to the input/output blockand the digital signal processing block, the driver block, and thereceiver block, and others, although there may be variations. In anexample, the device has a communication interface coupled to thecommunication block and a control block provided on the substrate memberand coupled to the communication block. In an example, the control blockis configured to receive and send instruction(s) in a digital format tothe communication block and being configured to receive and send signalsin an analog format to communicate with the silicon photonics device.

In an example, the present invention provides a monolithicallyintegrated system-on-chip device configured for a multi-rate andselected format of data communication. In an example, the device has asingle silicon substrate member. The device has a data input/outputinterface provided on the substrate member and configured for apredefined data rate and protocol. In an example, the data input/outputinterface is configured for number of lanes numbered from four to onehundred and fifty. The device has an input/output block provided on thesubstrate member and coupled to the data input/output interface, whichhas a SerDes block, a CDR block, a compensation block, and an equalizerblock. In an example, the SerDes block is configured to convert a firstdata stream of N into a second data stream of M. In an example, each ofthe first data stream has a first predefined data rate at a first clockrate and each of the second data stream having a second predefined datarate at a second clock rate. As used herein the terms “first” and“second” do not necessarily imply order and shall be construed broadlyaccording to ordinary meaning. In an example, the device has a signalprocessing block provided on the substrate member and coupled to theinput/output block. The signal processing block is configured to theinput/output block using a bi-direction bus in an intermediary protocolin an example. The device has a driver module provided on the substratemember and coupled to the signal processing block. In an example, thedriver module is coupled to the signal processing blocking using auni-directional multi-lane bus. In an example, the device has a driverinterface provided on the substrate member and coupled to the drivermodule and configured to be coupled to a silicon photonics device. In anexample, the driver interface is configured to transmit output data ineither an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format. Thedevice has a receiver module comprising a TIA block provided on thesubstrate member and to be coupled to the silicon photonics device usingpredefined modulation format, and is configured to the digital signalprocessing block to communicate information to the input output blockfor transmission through the data input/output interface. In an example,the device has a communication block provided on the substrate memberand operably coupled to the input/output block, the digital signalprocessing block, the driver block, and the receiver block, and others,although there can be variations. In an example, the device has acommunication interface coupled to the communication block and a controlblock provided on the substrate member and coupled to the communicationblock.

In an example, the present invention provides a monolithicallyintegrated system-on-chip device configured for a multi-rate andselected format of data communication. In an example, the device has asingle silicon substrate member. The device has a data input/outputinterface provided on the substrate member and configured for apredefined data rate and protocol. In an example, the data input/outputinterface is configured for number of lanes numbered from four to onehundred and fifty, although there can be variations. In an example, thedevice has an input/output block provided on the substrate member andcoupled to the data input/output interface. In an example, theinput/output block comprises a SerDes block, a CDR block, a compensationblock, and an equalizer block, among others. In an example, the SerDesblock is configured to convert a first data stream of X into a seconddata stream of Y, where X and Y are different integers. Each of thefirst data stream has a first predefined data rate at a first clock rateand each of the second data stream has a second predefined data rate ata second clock rate in an example. In an example, the device has asignal processing block provided on the substrate member and coupled tothe input/output block. In an example, the signal processing block isconfigured to the input/output block using a bi-direction bus in anintermediary protocol. In an example, the device has a driver moduleprovided on the substrate member and coupled to the signal processingblock. In an example, the driver module is coupled to the signalprocessing blocking using a uni-directional multi-lane bus configuredwith N lanes, whereupon N is greater than M such that a differencebetween N and M represents a redundant lane or lanes. In an example, thedevice has a mapping block configured to associate the M lanes to aplurality of selected laser devices for a silicon photonics device. Thedevice also has a driver interface provided on the substrate member andcoupled to the driver module and configured to be coupled to the siliconphotonics device. In an example, the driver interface is configured totransmit output data in either an amplitude modulation format or acombination of phase/amplitude modulation format or a phase modulationformat. In an example, the device has a receiver module comprising a TIAblock provided on the substrate member and to be coupled to the siliconphotonics device using predefined modulation format, and configured tothe digital signal processing block to communicate information to theinput output block for transmission through the data input/outputinterface. The device has a communication block provided on thesubstrate member and operably coupled to the input/output block, thedigital signal processing block, the driver block, and the receiverblock, among others. The device has a communication interface coupled tothe communication block and a control block provided on the substratemember and coupled to the communication block.

In an example, the device has an integrated system-on-chip device. Thedevice has a single silicon substrate member and a data input/outputinterface provided on the substrate member and configured for apredefined data rate and protocol. In an example, the device has aninput/output block provided on the substrate member and coupled to thedata input/output interface. In an example, the input/output blockcomprises a SerDes block, a CDR block, a compensation block, and anequalizer block, among others. The device has a signal processing blockprovided on the substrate member and coupled to the input/output block.The signal processing block is configured to the input/output blockusing a bi-direction bus in an intermediary protocol. The device has adriver module provided on the substrate member and coupled to the signalprocessing block. In an example, the driver module is coupled to thesignal processing blocking using a uni-directional multi-lane bus. In anexample, the device has a driver interface provided on the substratemember and coupled to the driver module and configured to be coupled toa silicon photonics device. In an example, the driver interface isconfigured to transmit output data in either an amplitude modulationformat or a combination of phase/amplitude modulation format or a phasemodulation format. In an example, the device has a receiver modulecomprising a TIA block provided on the substrate member and to becoupled to the silicon photonics device using predefined modulationformat, and configured to the digital signal processing block tocommunicate information to the input output block for transmissionthrough the data input/output interface. In an example, the device has acommunication block provided on the substrate member and operablycoupled to the input/output block, the digital signal processing block,the driver block, and the receiver block, and among others. The devicehas a communication interface coupled to the communication block and acontrol block provided on the substrate member and coupled to thecommunication block. In an example, the device has a variable bias blockconfigured with the control block. In an example, the variable biasblock is configured to selectively tune each of a plurality of laserdevices provided on the silicon photonics device to adjust for at leasta wavelength of operation, a fabrication tolerance, and an extinctionratio.

In an example, the present invention provides an integratedsystem-on-chip device having a self test using a loop back technique. Inan example, the device has a self-test block provided on the substrate,the self test block being configured to receive a loop back signal fromat least one of the digital signal processing block, the driver module,or the silicon photonics device. In an example, the self test blockcomprises a variable output power switch configured to provide a stressreceiver test from the loop back signal.

In an example, the invention provides an integrated system-on-chipdevice having a redundant laser or lasers configured for each channel.In an example, the device has a plurality of laser devices configured onthe silicon photonics device. At least a pair of laser devices isassociated with a channel and coupled to a switch to select one of thepair of laser devices to be coupled to an optical multiplexer to providefor a redundant laser device.

In an example, the present invention provides an integratedsystem-on-chip device having a built-in self test technique. In anexample, the device has a self test block configured on the siliconphotonics device and to be operable during a test operation. In anexample, the self test block comprises a broad band source configured toemit electromagnetic radiation from 1200 nm to 1400 nm or 1500 to 1600nm to a multiplexer device. In an example, the broad band source can bean LED or other suitable device. The device also includes a self testoutput configured to a spectrum analyzer device external to the siliconphotonics device.

The present invention achieves these benefits and others in the contextof known memory technology. However, a further understanding of thenature and advantages of the present invention may be realized byreference to the latter portions of the specification and attacheddrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following diagrams are merely examples, which should not undulylimit the scope of the claims herein. One of ordinary skill in the artwould recognize many other variations, modifications, and alternatives.It is also understood that the examples and embodiments described hereinare for illustrative purposes only and that various modifications orchanges in light thereof will be suggested to persons skilled in the artand are to be included within the spirit and purview of this process andscope of the appended claims.

FIG. 1 is a simplified diagram of a single hybrid die (Both electricaland optics devices are fabricated on a single hybrid die) according toan embodiment of the present invention.

FIG. 2 is a simplified diagram of a multi-chip module according to anembodiment of the present invention.

FIG. 2A is a simplified diagram of an exemplary hybrid silicon photonicsdevice.

FIG. 3 is a simplified diagram of an electrical silicon die blockaccording to an embodiment of the present invention.

FIG. 4 is a simplified diagram of high speed serial link block accordingto an embodiment of the present invention.

FIG. 5 is a simplified diagram of a digital processing/signalpre-distortion block according to an embodiment of the presentinvention.

FIG. 6 is a simplified diagram of an electrical laser driver and TIAblock diagram according to an embodiment of the present invention.

FIG. 7 is a simplified diagram of a silicon photonic block diagramaccording to an embodiment of the present invention.

FIG. 8 is a simplified block diagram of a multi-chip module for siliconphotonics according to an embodiment of the present invention.

FIG. 9 is a simplified block diagram of data flow according to anembodiment of the present invention.

FIG. 10 is a simplified diagram illustrating a redundant laserconfiguration at a drive stage according to an embodiment of the presentinvention.

FIG. 11 is a simplified diagram illustrating a built-in self test usingan optical loop back according to an embodiment of the presentinvention.

FIG. 12 is a simplified diagram illustrating a built-in self testconfigured for optical testing according to an embodiment of the presentinvention.

FIG. 13 is a simplified diagram illustrating a variable bias for opticalelements configured within a silicon photonic device according to anembodiment of the present invention.

FIG. 14 is a simplified diagram illustrating wavelength tuningconfigured to silicon photonic device according to an embodiment of thepresent invention.

FIG. 15 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, having a separate TX module and a separateRX module according to an alternative embodiment of the presentinvention.

FIG. 16 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, having a separate TX module according toan alternative embodiment of the present invention.

FIG. 17 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, one chip having a receive module coupledto another chip having a transmit module according to an alternativeembodiment of the present invention.

FIG. 18 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, having a separate receive module coupledto a separate process/control module and another separate transmitmodule coupled to a separate process/control module according to analternative embodiment of the present invention.

FIG. 19 is a simplified diagram of is a simplified block diagram of analternative multi-chip module for silicon photonics, having a separatedriver module coupled to separate a process/control module and aseparate integrated receive and process/control module according to analternative embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

This present invention relates to telecommunication techniques. Morespecifically, various embodiments of the present invention provide acommunication interface that is configured to transfer data at highbandwidth over optical communication networks. In certain embodiments,the communication interface is used by various devices, such as spineswitches and leaf switches, within a leaf-spine network architecture,which allows large amount of data to be shared among servers.

In the last decades, with advent of cloud computing and data center, theneeds for network servers have evolved. For example, the three-levelconfiguration that have been used for a long time is no longer adequateor suitable, as distributed applications require flatter networkarchitectures, where server virtualization that allows servers tooperate in parallel. For example, multiple servers can be used togetherto perform a requested task. For multiple servers to work in parallel,it is often imperative for them to be share large amount of informationamong themselves quickly, as opposed to having data going back forththrough multiple layers of network architecture (e.g., network switches,etc.).

Leaf-spine type of network architecture is provided to better allowservers to work in parallel and move data quickly among servers,offering high bandwidth and low latencies. Typically, a leaf-spinenetwork architecture uses a top-of-rack switch that can directly accessinto server nodes and links back to a set of non-blocking spine switchesthat have enough bandwidth to allow for clusters of servers to be linkedto one another and share large amount of data.

In a typical leaf-spine network today, gigabits of data are shared amongservers. In certain network architectures, network servers on the samelevel have certain peer links for data sharing. Unfortunately, thebandwidth for this type of set up is often inadequate. It is to beappreciated that embodiments of the present invention utilizes PAM(e.g., PAM8, PAM12, PAM16, etc.) in leaf-spine architecture that allowslarge amount (up terabytes of data at the spine level) of data to betransferred via optical network.

The following description is presented to enable one of ordinary skillin the art to make and use the invention and to incorporate it in thecontext of particular applications. Various modifications, as well as avariety of uses in different applications will be readily apparent tothose skilled in the art, and the general principles defined herein maybe applied to a wide range of embodiments. Thus, the present inventionis not intended to be limited to the embodiments presented, but is to beaccorded the widest scope consistent with the principles and novelfeatures disclosed herein.

In the following detailed description, numerous specific details are setforth in order to provide a more thorough understanding of the presentinvention. However, it will be apparent to one skilled in the art thatthe present invention may be practiced without necessarily being limitedto these specific details. In other instances, well-known structures anddevices are shown in block diagram form, rather than in detail, in orderto avoid obscuring the present invention.

The reader's attention is directed to all papers and documents which arefiled concurrently with this specification and which are open to publicinspection with this specification, and the contents of all such papersand documents are incorporated herein by reference. All the featuresdisclosed in this specification, (including any accompanying claims,abstract, and drawings) may be replaced by alternative features servingthe same, equivalent or similar purpose, unless expressly statedotherwise. Thus, unless expressly stated otherwise, each featuredisclosed is one example only of a generic series of equivalent orsimilar features.

Furthermore, any element in a claim that does not explicitly state“means for” performing a specified function, or “step for” performing aspecific function, is not to be interpreted as a “means” or “step”clause as specified in 35 U.S.C. Section 112, Paragraph 6. Inparticular, the use of “step of” or “act of” in the Claims herein is notintended to invoke the provisions of 35 U.S.C. 112, Paragraph 6.

Please note, if used, the labels left, right, front, back, top, bottom,forward, reverse, clockwise and counter clockwise have been used forconvenience purposes only and are not intended to imply any particularfixed direction. Instead, they are used to reflect relative locationsand/or directions between various portions of an object.

FIG. 1 is a simplified diagram of a single hybrid die (Both electricaland optics devices are fabricated on a single hybrid die) according toan embodiment of the present invention. In an example, the presentdevice comprises a single hybrid communication module made of siliconmaterial. The module comprises a substrate member having a surfaceregion, an electrical silicon chip overlying a first portion of thesurface region, an silicon photonics device overlying a second portionof the surface region, a communication bus coupled between theelectrical silicon chip and the silicon photonics device, an opticalinterface coupled to the silicon photonics device, and an electricalinterface coupled to the electrical silicon die.

FIG. 2 is a simplified diagram of a multi-chip module according to anembodiment of the present invention. In an example, the present devicecomprises a single hybrid communication module. The module comprises asubstrate member having a surface region, which can be a printed circuitboard or other member. The module comprises an electrical silicon chipoverlying a first portion of the surface region, a silicon photonicsdevice overlying a second portion of the surface region, a communicationbus coupled between the electrical silicon chip and the siliconphotonics device, an optical interface coupled to the silicon photonicsdevice, and an electrical interface coupled to the electrical silicondie.

As shown in FIG. 1, the single hybrid die includes a hybrid siliconphotonics device having an electrical circuit for processing and controland a silicon photonics module. In an example, the hybrid siliconphotonics device is described in U.S. Pat. No. 8,380,033, in the name ofFang, et al. issued Feb. 19, 2013, hereby incorporated by reference.FIG. 2A shows a simplified block diagram of an exemplary hybrid siliconphotonics device.

In this example, electro-optic device 200 includes a siliconsemiconductor slab including silicon top layer 201, vertical confinementlayer 202 and silicon substrate 203. Alternatively, substrate layer 203may be a diamond substrate, a glass substrate, or any functionalequivalent. Vertical confinement layer 202 may be formed of anydielectric material suitable for confining an optical mode (e.g., layer201 may be a silicon dioxide layer, a silicon nitride layer, or anyfunctionally equivalent insulating layer with a refractive index lowerthan silicon top layer 201).

Device 200 further includes a III-V semiconductor slab including p-typelayer 208, active layer 209 and n-type layer 210 (thereby forming aP-I-N diode). The term “p-type layer,” as used herein, describes a layercomprising a material that has more positive carriers (i.e., holes) thannegative carriers (i.e., electrons). The term “n-type layer,” as usedherein, describes a layer comprising a material that has more negativecarriers than positive carriers.

Alternatively, layer 208 may be an n-type layer, and layer 210 may be ap-type layer. Or, layers 208 and 210 may be n-type layers, while activeregion 209 may include a tunnel junction to convert n-type majoritycarriers to p-type majority carriers. This avoids the associated opticaland microwave loss of p-type materials due to the use of p-dopants.

III-V semiconductor materials have elements that are found in group IIIand group V of the periodic table (e.g., Indium Gallium ArsenidePhosphide, Gallium Indium Arsenide Nitride). The carrier dispersioneffects of III-V based materials may be significantly higher than insilicon based materials for bandgaps closer to the wavelength of thelight being transmitted or modulated, as electron speed in III-Vsemiconductors is much faster than that in silicon. In addition, III-Vmaterials have a direct bandgap which is required for the most efficientcreation of light from electrical pumping. Thus, III-V semiconductormaterials enable photonic operations with an increased efficiency oversilicon for both generating light and modulating the refractive index oflight.

Active layer 209 is of a III-V semiconductor with high electro-opticefficiency, i.e., the absorption coefficient (i.e., the imaginaryportion of the complex refractive index) and the refractive index (i.e.,the real portion of the complex refractive index) of active layer 209 iseasily affected by either the Franz Kheldysh effect if active layer 209comprises bulk material (e.g., intrinsic Indium Gallium ArsenidePhosphide or Indium Aluminum Gallium Arsenide or the Quantum ConfinedStark Effect if active layer 209 comprises multiple quantum wells.

Optical waveguide 250 is formed by ridge 260 (which is “bolded” or“thicker” in the figure for illustrative purposes only), including ridgesides 261 and 262. It is clear that in this embodiment, waveguide 250 isformed by features in the III-V region of device 200 as opposed to beingformed by features in the silicon region of the device, whereinwaveguide is formed by voids included in silicon top region. Thus, thesilicon and III-V regions of device 200 have a greater contact area thandevices in the prior art (where layer 210 was continuously coupled tolayer 201).

Overclad regions 207 may be formed on the device to improve mechanicalstability, and may be of any material used to form vertical confinementlayer 202 or any material with a lower refractive index than layer 208.Overclad regions 207 further provide vertical optical confinement andpassivation as described below. The areas adjacent to ridge sides 261and 262 provide optical confinement if left as voids (i.e., areascomprising air), but that forming overclad regions 207 provides formechanical stability in addition to optical confinement.

Thus, optical mode 213 is vertically confined by vertical confinementlayer 202, ridge 260 and overclad regions 207 while being laterallyconfined by ridge sides 261 and 262. Said ridge sides also confineinjection current from electrode 206 towards the portion of active layer209 that overlaps optical mode 213. The need for the etched regions andimplanted regions is eliminated in the example shown above.

It is understood that the optical device of FIG. 2A may be used toamplify, modulate or detect light transmitted through the opticalwaveguide of the device by applying an electrical difference tocomplimentary electrodes 206 and 212 to either forward bias (i.e., foramplification) or reverse bias (i.e., for modulation or detection) thestructure. The complex refractive index (i.e., at least one of the realand the imaginary refractive index) of at least the portion of activelayer 209 included in optical mode 213 changes based on an electricaldifference (e.g., electrical voltage, electrical field) applied toelectrodes 206 and 212. These changes to the refractive index (orindexes) are proportional to the strength of the electrical differenceapplied to electrodes 206 and 212.

In this example, electrodes 212 are coupled to n-type layer 210. Thus,it is to be understood that there is no electrical conduction throughsilicon top layer 201. As opposed to variations where electricalconduction does occur through the silicon top layer of a device,resistance is high as it determined by thin layer 210; however, thereare less processing steps needed to create device 200 and no conductivebond is required to couple the silicon region with the III-V region(i.e., no conductive bond is required to couple layers 210 and 201).

Other examples of silicon photonic devices are manufactured by IntelCorporation of Santa Clara, Calif., Skorpis Technology, Inc. 5600 EubankBlvd. NE Suite 200, Albuquerque, N. Mex. 87111, Luxtera, Inc. of 2320Camino Vida Roble, Carlsbad, Calif. 92011, Mellanox Technologies, Inc.350 Oakmead Parkway, Suite 100 Sunnyvale, Calif. 94085, and amLightwire, Inc. Headquartered in Allentown, Pa. (now Cisco Systems,Inc., Corporate Headquarters, 170 West Tasman Dr., San Jose, Calif.95134) among others.

FIG. 3 is a simplified diagram of an electrical silicon die blockaccording to an embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of theclaims. One of ordinary skill in the art would recognize manyvariations, alternatives, and modifications. In an embodiment, theelectrical silicon die block is an electrical signal processing blockthat connects a low speed electrical interface to a high speed opticalinterface. There are several elements to this block diagram. As shown,the electrical silicon die block includes a high speed serial link 310,a digital signal processing/pre-distortion unit 320, and a lasermodulator driver and TIA unit 330. The high speed serial link 310includes an input/output block having an RX (receiving) functional unitand a TX (transmitting) function unit coupled to a phase lock loopcircuit. For example, the TX function unit drives the loopback signalsthat are processed by the RX functional unit. Using the high speedserial link 310, the data first is able to be converted from the manyparallel streams of lower speed data into a high speed serial stream(there may be more than one such high speed stream depending on thetotal data rate). The digital signal processing/pre-distortion unit 320is configured to process or convert digital electrical signal back andforth to optical signal and conduct all signal modulation, errorencoding/decoding, and signal distortion compensation. The high speedstreams converted by the high speed serial link 310 are then encoded anddigitally compensated to account for distortions in the transmit andreceive paths. The final interface to the optical components is achievedvia the modulator driver (transmit path) and the transimpedanceamplifier (receive path). The laser modulator driver and TIA unit 330 isconfigured to control the optical device (such as the optics siliconphotonics die on the part of the multi-chip module in FIG. 2). In aspecific embodiment, the electrical silicon die block is a single hybriddie as part of the multi-chip module shown in FIG. 2.

FIG. 4 is a simplified diagram of high speed serial link block accordingto an embodiment of the present invention. This diagram is merely anexample, which should not unduly limit the scope of the claims. One ofordinary skill in the art would recognize many variations, alternatives,and modifications. As shown, the high speed serial link block providesdetails of the signal interface between the high speed optical and thelower speed electrical sides. In an embodiment, the high speed seriallink block comprises multiple Bits Flash Samplers 410 and an All digitalSerDes core unit 420 powered under a low Vdd power supply. The samplers410 are part of RX functional unit of the input/output block 310. Theall digital SerDes core unit 420 comprises an all digital phase lockloop (PLL) block 422, a fast lock CDR block 424, and Digital offsetcalibrations and logics block 426, also belonging to the RX functionalunit (310 of FIG. 3). In another embodiment, the high speed serial linkblock is an electrical input/output block provided on either a singlechip or a silicon die of package substrate member and coupled to thedata input/output interface. Some of the essential components of theelectrical input/output block are CDR (clock and data recoverycircuits), PLL (phase lock loops), and SerDes (Serializers andDeserializers). In an example, the input/output block comprises a SerDesblock, a CDR block, a compensation block, and an equalizer block, amongothers. The output of equalizer includes receiver input. These circuitsin combination convert multiple streams of input data (electrical side)to fewer streams of output data (optical side). These circuits also needto be calibrated and controlled to operate correctly.

FIG. 5 is a simplified diagram of a digital processing/signalpre-distortion block according to an embodiment of the presentinvention. This diagram is merely an example, which should not undulylimit the scope of the claims. One of ordinary skill in the art wouldrecognize many variations, alternatives, and modifications. As shown,the digital processing/signal pre-distortion block comprises at least anError Encoding/Decoding block 510, an Optical Distortion/ElectricalCompensation (EDC) block 520, and a Modulation Conversion block 530. Inan example, it shows the details of a possible implementation of theelectronic processing blocks in the transmit and receive paths. In analternative embodiment, some of those blocks may be configureddifferently in the transmit versus the receive path. One of theessential blocks is the Error Encoding/Decoding block 510 which performsdata error control coding. As additional data bits are added to blocksof signal data in such a way that when errors occur they may becorrectable in the receive path. Modern error control codes aresophisticated that they can correct, e.g., up to 1 error in every 100bits with modest data overhead and latency. Optical distortioncompensation block 520 helps compensate for impairments in the opticaland electrical transmission paths. These could include compensation of,e.g., bandwidth limitations and inter-symbol interference. Themodulation conversion block 530 codes and decodes the multi-levelhigher-order modulation signals that are used at the transmitter andreceiver, and converts them to the simple two-level NRZ format used inthe lower speed interfaces.

FIG. 6 is a simplified diagram of an electrical laser driver and TIAblock diagram according to an embodiment of the present invention. Thisdiagram is merely an example, which should not unduly limit the scope ofthe claims. One of ordinary skill in the art would recognize manyvariations, alternatives, and modifications. As shown, the top partcircuit (A) of an electrical laser driver and TIA block shows a drivercircuit for the modulator and the receiver circuit for a photo diodedetector (to be shown in FIG. 7 below). The electrical output of the topcircuit (A) is used to drive the modulator. The modulator imprints theelectrical signal input on to the optical carrier. The output of thephoto diode detector is the input to the bottom part circuit (B) of theelectrical laser driver and TIA block. This circuit converts the currentsignal from the photo diode detector into a voltage signal which canthen be processed by other circuits. In an example, the electrical laserdriver and TIA block is block 330 included in the electrical silicon dieblock shown in FIG. 3.

FIG. 7 is a simplified diagram of a silicon photonic block diagramaccording to an embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of theclaims. One of ordinary skill in the art would recognize manyvariations, alternatives, and modifications. As shown, in an embodiment,a silicon photonic block 700 includes a laser source 710, a lasermodulator 720, a control loop 730, and one or more photo detectors 740.In a specific embodiment, the silicon photonic block 700 includes commonblocks of an optical sub-system including control loops. The transmitpath of the optical sub-system includes a laser source 710 which can beselected from a CW (continuous wave) DFB (distributed feedback) laseramong others. The laser source 710 provides the optical carrier. Theoutput from the laser source 710 is optically coupled into the lasermodulator 720. The electrical data is converted to optical via themodulator for modulating the optical signal directly from the lasersource 710. The modulator 720 may be an electro-absorption modulator ora Mach-Zehnder (MZ) modulator, or others depending on embodiments. Theoutput signal from the modulator 720 is then coupled to a fiber (notshown) for external transmission. The receive path of the opticalsub-system includes the optical signal from the fiber coupled into oneor more photo diode detectors 740. The photo diode detector 740 convertsthe optical data into electrical data. The control loops 730 are neededto correctly bias the laser source 710, the modulator 720, and the oneor more photo diode detectors 740. The bias control signals may includecurrent or voltage outputs used to setup the laser source, modulator,and the photo diode detector correctly. The control output signals mayalso be continually adjusted using the feedback from the devicesthemselves.

FIG. 8 is a simplified block diagram of a multi-chip module for siliconphotonics according to an embodiment of the present invention. As shown,the present invention includes an integrated system-on-chip device. Thedevice is configured on a single silicon substrate member. The devicehas a data input/output interface provided on the substrate member andconfigured for a predefined data rate and protocol. The device has aninput/output block provided on the substrate member and coupled to thedata input/output interface. In an example, the input/output blockcomprises a SerDes block, a CDR block, a compensation block, and anequalizer block, among others. The device has a signal processing blockprovided on the substrate member and coupled to the input/output block.In an example, the signal processing block is configured to theinput/output block using a bi-direction bus in an intermediary protocol.The device has a driver module provided on the substrate member andcoupled to the signal processing block. In an example, the driver moduleis coupled to the signal processing blocking using a uni-directionalmulti-lane bus. In an example, the device has a driver interfaceprovided on the substrate member and coupled to the driver module andconfigured to be coupled to a silicon photonics device. In an example,the driver interface is configured to transmit output data in either anamplitude modulation format or a combination of phase/amplitudemodulation format or a phase modulation format. In an example, thedevice has a receiver module comprising a TIA block provided on thesubstrate member and to be coupled to the silicon photonics device usingpredefined modulation format, and configured to the digital signalprocessing block to communicate information to the input output blockfor transmission through the data input/output interface. In an example,the device has a communication block provided on the substrate memberand operably coupled to the input/output block, the digital signalprocessing block, the driver block, and the receiver block, amongothers. The device has a communication interface coupled to thecommunication block. The device has a control block provided on thesubstrate member and coupled to the communication block. In a specificembodiment, the control block is configured to receive and sendinstruction(s) in a digital format to the communication block and isconfigured to receive and send signals in an analog format tocommunicate with the silicon photonics device. In another specificembodiment, the integrated system-on-chip device is a single chip module800.

In an example, the signal processing block comprises a FEC block, adigital signal processing block, a framing block, a protocol block, anda redundancy block, among others. The driver module is selected from acurrent drive or a voltage driver in an example. In an example, thedriver module is a differential driver or the like. In an example, thesilicon photonics device is selected from an electro absorptionmodulator (EAM) or electro optic modulator (EOM), or a Mach-Zehndermodulator (MZM). In an example, the amplified modulation format isselected from NRZ format or PAM format. In an example, the phasemodulation format is selected from BPSK or nPSK. In an example, thephase/amplitude modulation is QAM. In an example, the silicon photonicdevice is configured to convert the output data into an output transportdata in a WDM signal. In an example, the control block is configured toinitiate a laser bias or a modulator bias. In an example, the controlblock is configured for laser bias and power control of the siliconphotonics device. In an example, the control block is configured with athermal tuning or carrier tuning device each of which is configured onthe silicon photonics device. In an example, the SerDes block isconfigured to convert a first data stream of N into a second data streamof M.

FIG. 9 is a simplified block diagram of data flow according to anembodiment of the present invention. As show is a stream of incomingdata, which processed through multiple blocks. The blocks include, amongothers, forward error correction, and other encoding, multi-levelcoding, pre-compression, and digital to analog coding. The blocks alsoinclude non-DSP forward error correction, and a block corresponding to alaser diode or driver, among others. In an example, in the absence of aFEC from a host process, techniques include use of CDR2 type FEC, whichis internal to the CMOS chip. In an example, FEC can be striped acrosseach or all of data lanes. Of course, there can be variations,modifications, and alternatives.

FIG. 10 is a simplified diagram illustrating a redundant laserconfiguration at a drive stage according to an embodiment of the presentinvention. In an example, the invention provides an integratedsystem-on-chip device as a fully redundant system having a redundantlaser or lasers configured for each channel. In an example, the devicehas a plurality of laser devices configured on the silicon photonicsdevice. At least a pair of laser devices is associated with a channeland coupled to a switch to select one of the pair of laser devices to becoupled to an optical multiplexer to provide for a redundant laserdevice. The worst case is to have 2 times total number of wavelengthswith twice in chip size. In an embodiment, the switch is a Mach-ZehnderInterferometer (MZI) switch used to switch between λ1 and λ1′. Or itcould be a passive coupler. In another embodiment, it preserves the sizeof the wavelength multiplexer so that no additional λ channels areneeded. Note, the integrated system-on-chip device doesn't have tooperate λ1′ until needed, therefore no power consumption penalty isapplied.

FIG. 11 is a simplified diagram illustrating a built-in self test usingan optical loop back according to an embodiment of the presentinvention. As shown are a TX multiplexer and an RX multiplexer for asilicon photonics device. In an example, the present invention providesan integrated system-on-chip device having a self test using a loop backtechnique. In an example, the device has a self-test block provided onthe substrate. In an example, the self test block is configured toreceive a loop back signal from at least one of the digital signalprocessing block, the driver module, or the silicon photonics device. Inan example, the self test block comprises a variable output power switchconfigured to provide a stress receiver test from the loop back signal.Also shown is an isolation switch between RX and TX.

In an example, the present technique allows a loop back test capabilityon the device, which is now a silicon photonic application specificintegrated circuit or a communication system-on-chip device, asdescribed. In an example, the technique is provided for diagnostic andsetup during power up sequence. In an example, an optical tap coupler onthe output side connected to the input side as shown. In an example asshown, x (e.g., <10%) is selected to reduce and/or minimize an impact anoutput power as well an impact at the input power given that input poweris generally much lower than the output power. In an example, to preventcrosstalk in the present loop back path, an isolation switch has beenconfigured as shown. In an example, without the isolation switch thereis undesirably direct crosstalk between the output and input as shown.In an example, about 30 dB isolation is included to prevent coherentcrosstalk. Of course, there can be variations.

FIG. 12 is a simplified diagram illustrating a built-in self testconfigured for optical testing according to an embodiment of the presentinvention. In an example, the present invention provides an integratedsystem-on-chip device having a built-in self test technique. As shownare a TX multiplexer and an RX multiplexer for a silicon photonicsdevice. A broad band source is coupled to each of the multiplexers.Multiple sources can also be included. In an example, the device has aself test block configured on the silicon photonics device and to beoperable during a test operation. In an example, the self test blockcomprises a broad band source configured to emit electromagneticradiation from 1200 nm to 1400 nm or 1500 to 1600 nm to a multiplexerdevice. In an example, the broad band source can be an LED or othersuitable device. The device also includes a self test output configuredto a spectrum analyzer device external to the silicon photonics device.In an example, the technique can be provided during a calibrationprocess. That is, if after calibration, a center λ of each multiplexerchanged, the present technique including built-in light source willquantify or indicate the change in an example. In an example, thebroadband source in silicon photonics is a light source with no opticalfeedback, although there can be variations.

FIG. 13 is a simplified diagram illustrating a variable bias for opticalelements configured in a silicon photonic device according to anembodiment of the present invention. As shown, optical elements,particularly, driver blocks comprising optical modulators, whether theyare EAM's EOM's (which are really MZM's), need a DC bias for operation.The DC bias is a function of λ of operation and also of fabricationtolerances including temperature variations. For different λ ofoperation, the output or absolute transmission will vary with the biasvoltage values. Accordingly, the bias circuitry will have to accommodatethe bias variations. If this not designed correctly, it could end upconsuming a lot of power. In an example, the device has an integratedsystem-on-chip device having a capability selectively adjust eachoptical modulator to accommodate for fabrication tolerances, wavelengthoperation, and/or extinction ratio, among other parameters. The devicehas a single silicon substrate member and a data input/output interfaceprovided on the substrate member and configured for a predefined datarate and protocol. In an example, the device has an input/output blockprovided on the substrate member and coupled to the data input/outputinterface. In an example, the input/output block comprises a SerDesblock, a CDR block, a compensation block, and an equalizer block, amongothers. The device has a signal processing block provided on thesubstrate member and coupled to the input/output block. The signalprocessing block is configured to the input/output block using abi-direction bus in an intermediary protocol. The device has a drivermodule provided on the substrate member and coupled to the signalprocessing block.

In an example, the driver module is coupled to the signal processingblocking using a uni-directional multi-lane bus. In an example, thedevice has a driver interface provided on the substrate member andcoupled to the driver module and configured to be coupled to a siliconphotonics device. In an example, the driver interface is configured totransmit output data in either an amplitude modulation format or acombination of phase/amplitude modulation format or a phase modulationformat. In an example, the device has a receiver module comprising a TIAblock provided on the substrate member and to be coupled to the siliconphotonics device using predefined modulation format, and configured tothe digital signal processing block to communicate information to theinput output block for transmission through the data input/outputinterface. In an example, the device has a communication block providedon the substrate member and operably coupled to the input/output block,the digital signal processing block, the driver block, and the receiverblock, and among others. The device has a communication interfacecoupled to the communication block and a control block provided on thesubstrate member and coupled to the communication block.

In an example, the device has a variable bias block configured with thecontrol block. In an example, the variable bias block is configured toselectively tune each of a plurality of laser devices provided on thesilicon photonics device to adjust for at least a wavelength ofoperation, a fabrication tolerance, and an extinction ratio. As shown isa plurality of driver blocks. Each of the driver blocks is coupled to avoltage rail, and is configured with a variable voltage device toselectively tune each of the laser devices. In an example, each of thelaser devices can be configured with an optical modulator(s) such aselectro-absorption modulators, electro-optical modulators, among others,which often couple to a direct current power or bias. In an example, theDC bias is a function of wavelength of operation and also of fabricationtolerances, among other factors. In an example, the present biascircuitry accommodates and/or corrects for any bias variations, whiledesirably controlling power. Of course, there can be variations,modifications, and alternatives.

FIG. 14 is a simplified diagram illustrating wavelength tuningconfigured to silicon photonic device according to an embodiment of thepresent invention. In an example, the present tunable laser uses a setof rings with resonant frequencies that a slightly different. In anexample, the technique uses a Vernier effect to tune the laser over awide frequency range—limited by the bandwidth of the gain region. In anexample, the Vernier desirably would be held in lock with respect to oneanother with a frequency difference Δf. In an example, the techniqueuses a dither frequency on one of the biases (e.g., heater) and lock thering to the maximum transmission of the second ring, although there canbe variations. As shown, resonant combs are generally misaligned, Δf+δ,in an example. When thermally tuned, techniques can be used toselectively align one of the combs to another comb or spatial reference.In an example, to maintain alignment, the technique dithers the signalto one of the rings to do maximum search. Of course, there can bevariations, alternatives, and modifications.

FIG. 15 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, having a separate TX module and an RXmodule according to an alternative embodiment of the present invention.This diagram is merely an example, which should not unduly limit thescope of the claims. One of ordinary skill in the art would recognizemany variations, alternatives, and modifications. As shown, the presentinvention includes an integrated system-on-chip device, or simply called“device” hereafter, configured on three separate silicon substratemembers. The device has a data input/output interface provided on afirst silicon substrate member and configured for a predefined data rateand protocol. The device has an input/output block provided on the firstsilicon substrate member and coupled to the data input/output interface.In an example, the input/output block comprises a SerDes block, a CDRblock, a compensation block, and an equalizer block, among others. Thedevice has a signal processing block also provided on the first siliconsubstrate member and coupled to the input/output block. In an example,the signal processing block is configured to couple with theinput/output block using a bi-direction bus in an intermediary protocol.Additionally, the device has a driver module provided on a secondsilicon substrate member and coupled to the signal processing block onthe first silicon substrate member. In an example, the driver module iscoupled to the signal processing block using a uni-directionalmulti-lane bus. In an example, the device has a driver interface coupledto the driver module and configured to be coupled to a silicon photonicsdevice. In an example, the driver interface is configured to transmitoutput data in either an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format.Furthermore, the device has a receiver module comprising a TIA blockprovided on a third silicon substrate member and to be coupled to thesilicon photonics device using predefined modulation format, andconfigured to couple with the signal processing block to communicateinformation to the input/output block for transmission through the datainput/output interface. In an example, the device has a communicationblock provided on the first silicon substrate member and operablycoupled to the input/output block, the signal processing block, thedriver module on the second substrate member through PCB trances, andthe receiver module on the third substrate member through alternativePCB trances, among others. The device has a communication interfacecoupled to the communication block. The device has a control blockprovided on the first silicon substrate member and coupled to thecommunication block. In a specific embodiment, the control block isconfigured to receive and send instruction(s) in a digital format to thecommunication block and is configured to receive and send signals in ananalog format to communicate with the silicon photonics device. Inanother specific embodiment, the integrated system-on-chip device is amulti-chip module 1500.

In a specific embodiment, the integrated system-on-chip device is athree-chip module 1500 including a first chip subsystem 1510 comprisingan input/output block, a digital signal processing block, a controlblock, and a communication block. The three-chip module 1500 alsoincludes a second chip subsystem which is a driver module 1520,configured to couple with the digital signal processing block using auni-directional multi-lane bus and further to couple with a siliconphotonics device 1540 through an driver interface configured to transmitoutput data in either an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format. Thethree-chip module 1500 further includes a third chip subsystem which isa receiver module 1530, configured to couple to the silicon photonicsdevice 1540 using predefined modulation format. The receiver module 1530further is configured to couple with the digital signal processing blockto communicate information to the input/output block for transmissionthrough the data input/output interface.

In an example, the first chip subsystem 1510 further comprises a FECblock, a framing block, a protocol block, and a redundancy block, amongothers. The driver module 1520 is selected from a current driver in anexample or a voltage driver in another example. In yet another example,the driver module 1520 is a differential driver or the like. In anexample, the silicon photonics device 1540 includes a modulator selectedfrom an electro absorption modulator (EAM) or electro optic modulator(EOM), or a Mach-Zehnder modulator (MZM). In an example, the amplifiedmodulation format is selected from NRZ format or PAM format. In anexample, the phase modulation format is selected from BPSK or nPSK. Inan example, the phase/amplitude modulation is QAM. In an example, thefirst chip subsystem 1510 is configured to send control signals from thecontrol block to the silicon photonics device and receive feedbacksignals from the silicon photonics device 1540. In an example, thesilicon photonics device 1540 is configured to convert the output datainto an output transport data in a WDM signal. In an example, thecontrol block is configured to initiate a laser bias or a modulator biasas control signals. In an example, the control block is configured forlaser bias control and power control of the silicon photonics device1540 sent through the driver module via PCB trances. In an example, thecontrol block is configured with a thermal tuning or carrier tuningdevice each of which is configured on the silicon photonics device 1540.In an example, the input/output block includes a SerDes block configuredto convert a first data stream of N into a second data stream of M.

FIG. 16 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, having a separate TX module according toan alternative embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of theclaims. One of ordinary skill in the art would recognize manyvariations, alternatives, and modifications. As shown, the presentinvention includes an integrated system-on-chip device, or simply called“device” hereafter, configured on two separate silicon substratemembers. The device has a data input/output interface provided on afirst silicon substrate member and configured for a predefined data rateand protocol. The device has an input/output block provided on the firstsilicon substrate member and coupled to the data input/output interface.In an example, the input/output block comprises a SerDes block, a CDRblock, a compensation block, and an equalizer block, among others. Thedevice has a signal processing block also provided on the first siliconsubstrate member and coupled to the input/output block. In an example,the signal processing block is configured to couple with theinput/output block using a bi-direction bus in an intermediary protocol.Additionally, the device has a driver module provided on a secondsilicon substrate member and coupled to the signal processing block onthe first silicon substrate member. In an example, the driver module iscoupled to the signal processing block using a uni-directionalmulti-lane bus. In an example, the device has a driver interface coupledto the driver module and configured to be coupled to a silicon photonicsdevice. In an example, the driver interface is configured to transmitoutput data in either an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format.Furthermore, the device has a receiver module comprising a TIA blockprovided on the first silicon substrate member and to be coupled to thesilicon photonics device using predefined modulation format, andconfigured to couple with the signal processing block to communicateinformation to the input/output block for transmission through the datainput/output interface. In an example, the device has a communicationblock provided on the first silicon substrate member and operablycoupled to the input/output block, the signal processing block, thedriver module on the second substrate member through PCB traces, and thereceiver module, among others. The device has a communication interfacecoupled to the communication block. The device has a control blockprovided on the first silicon substrate member and coupled to thecommunication block. In a specific embodiment, the control block isconfigured to receive and send instruction(s) in a digital format to thecommunication block and is configured to receive and send signals in ananalog format to communicate with the silicon photonics device. Inanother specific embodiment, the integrated system-on-chip device is amulti-chip module 1600.

In a specific embodiment, the integrated system-on-chip device is atwo-chip module 1600 including a first chip subsystem 1610 comprising aninput/output block, a digital signal processing block, a control block,a communication block, and a receiver module. The two-chip module 1600also includes a second chip subsystem which is a driver module 1620,configured to couple with the digital signal processing block using auni-directional multi-lane bus and further to couple with a siliconphotonics device 1640 through an driver interface configured to transmitoutput data in either an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format. Thereceiver module is configured to couple to the silicon photonics device1640 using predefined modulation format and configured to couple withthe digital signal processing block to communicate information to theinput/output block for transmission through the data input/outputinterface.

In an example, the first chip subsystem 1610 further comprises a FECblock, a framing block, a protocol block, and a redundancy block, amongothers. The driver module 1620 is selected from a current driver in anexample or a voltage driver in another example. In yet another example,the driver module 1620 is a differential driver or the like. In anexample, the silicon photonics device 1640 includes a modulator selectedfrom an electro absorption modulator (EAM) or electro optic modulator(EOM), or a Mach-Zehnder modulator (MZM). In an example, the amplifiedmodulation format is selected from NRZ format or PAM format. In anexample, the phase modulation format is selected from BPSK or nPSK. Inan example, the phase/amplitude modulation is QAM. In an example, thefirst chip subsystem 1610 is configured to send control signals from thecontrol block to the silicon photonics device and receive feedbacksignals from the silicon photonics device 1640. In an example, thesilicon photonics device 1640 is configured to convert the output datainto an output transport data in a WDM signal. In an example, thecontrol block in the first chip subsystem 1610 is configured to initiatea laser bias or a modulator bias as control signals and coupled to thedriver module 1620 for sending the control signal to the siliconphotonics device 1640. In an example, the control block is configuredfor laser bias control and power control of the silicon photonics device1640. In an example, the control block is configured with a thermaltuning or carrier tuning device each of which is configured on thesilicon photonics device 1640. In an example, the input/output blockincludes a SerDes block configured to convert a first data stream of Ninto a second data stream of M.

FIG. 17 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, one chip having a receive module coupledto another chip having a transmit module according to an alternativeembodiment of the present invention. This diagram is merely an example,which should not unduly limit the scope of the claims. One of ordinaryskill in the art would recognize many variations, alternatives, andmodifications. As shown, the present invention includes an integratedsystem-on-chip device, or simply called “device” hereafter, configuredon two separate silicon substrate members. The device has a first datainput/output interface provided on a first silicon substrate member andconfigured for a predefined data rate and protocol. The device has afirst input/output block provided on the first silicon substrate memberand coupled to the first data input/output interface. In an example, thefirst input/output block comprises a SerDes block, a CDR block, acompensation block, and an equalizer block, among others. The device hasa first signal processing block also provided on the first siliconsubstrate member and coupled to the first input/output block. In anexample, the first signal processing block is configured to couple withthe first input/output block using a bi-direction bus in an intermediaryprotocol. Additionally, the device includes a driver module provided onthe first silicon substrate member and coupled to the first signalprocessing block. In an example, the driver module is coupled to thefirst signal processing block using a uni-directional multi-lane bus. Inan example, the device has a driver interface coupled to the drivermodule and configured to be coupled to a silicon photonics device. In anexample, the driver interface is configured to transmit output data ineither an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format. In anexample, the device has a first communication block provided on thefirst silicon substrate member and operably coupled to the firstinput/output block, the first signal processing block, and the drivermodule, among others. The device has a first communication interfacecoupled to the first communication block. The device has a first controlblock provided on the first silicon substrate member and coupled to thefirst communication block. In a specific embodiment, the first controlblock is configured to receive and send instruction(s) in a digitalformat to the first communication block and is configured to receive andsend signals in an analog format to communicate with the siliconphotonics device.

In an embodiment, the device also includes a second data input/outputinterface provided on a second silicon substrate member and configuredfor a predefined data rate and protocol. The device has a secondinput/output block provided on the second silicon substrate member andcoupled to the second data input/output interface. In an example, thesecond input/output block comprises a SerDes block, a CDR block, acompensation block, and an equalizer block, among others. The devicefurther include a second signal processing block also provided on thesecond silicon substrate member and coupled to the second input/outputblock. In an example, the second signal processing block is configuredto couple with the second input/output block using a bi-direction bus inan intermediary protocol. Additionally, the device has a receiver modulecomprising a TIA block provided on the second silicon substrate memberand to be coupled to the silicon photonics device using predefinedmodulation format, and configured to couple with the second signalprocessing block to communicate information to the second input/outputblock for transmission through the second data input/output interface.In an example, the device has a second communication block provided onthe second silicon substrate member and operably coupled to the secondinput/output block, the second signal processing block, and the receivermodule, among others. The device has a second communication interfacecoupled to the second communication block. The device has a secondcontrol block provided on the second silicon substrate member andcoupled to the second communication block. In a specific embodiment, thesecond control block is configured to receive and send instruction(s) ina digital format to the second communication block and is configured toreceive and send signals in an analog format to communicate with thesilicon photonics device.

In a specific embodiment, as shown in FIG. 17, the integratedsystem-on-chip device is a two-chip module 1700 including a first chipsubsystem 1710 comprising a first input/output block, a first digitalsignal processing block, a first control block, a first communicationblock, and a driver module configured to couple with the first digitalsignal processing block using a uni-directional multi-lane bus andfurther to couple with a silicon photonics device 1740 through an driverinterface configured to transmit output data in either an amplitudemodulation format or a combination of phase/amplitude modulation formator a phase modulation format. The two-chip module 1700 also includes asecond chip subsystem 1720 comprising a second input/output block, asecond digital signal processing block, a second control block, a secondcommunication block, and a receiver module. Additionally, the receivermodule is configured to couple to the silicon photonics device 1740using predefined modulation format and configured to couple with thesecond digital signal processing block to communicate information to thesecond input/output block for transmission through the second datainput/output interface.

In an example, each of the first chip subsystem 1710 and the second chipsubsystem 1720 further comprises a FEC block, a framing block, aprotocol block, and a redundancy block, among others. The driver moduleis selected from a current driver in an example or a voltage driver inanother example. In yet another example, the driver module is adifferential driver or the like. In an example, the silicon photonicsdevice 1740 includes a modulator selected from an electro absorptionmodulator (EAM) or electro optic modulator (EOM), or a Mach-Zehndermodulator (MZM). In an example, the amplified modulation format isselected from NRZ format or PAM format. In an example, the phasemodulation format is selected from BPSK or nPSK. In an example, thephase/amplitude modulation is QAM. In an example, the first chipsubsystem 1710 is configured to send control signals from the firstcontrol block to the silicon photonics device and receive feedbacksignals from the silicon photonics device 1740. In an example, thesilicon photonics device 1740 is configured to convert the output datainto an output transport data in a WDM signal. In an example, the firstcontrol block in the first chip subsystem 1710 is configured to initiatea laser bias or a modulator bias as control signals. In an example, thefirst control block is configured for laser bias control and powercontrol of the silicon photonics device 1740. In an example, the firstcontrol block is configured with a thermal tuning or carrier tuningdevice each of which is configured on the silicon photonics device 1740.In an example, the first input/output block includes a SerDes blockconfigured to convert a first data stream of N into a second data streamof M.

FIG. 18 is a simplified block diagram of an alternative multi-chipmodule for silicon photonics, having a separate receive module coupledto a separate process/control module and a separate transmit modulecoupled to another separate process/control module according to analternative embodiment of the present invention. This diagram is merelyan example, which should not unduly limit the scope of the claims. Oneof ordinary skill in the art would recognize many variations,alternatives, and modifications. As shown, the present inventionincludes an integrated system-on-chip device, or simply called “device”hereafter, configured on four separate silicon substrate members. Thedevice has a first data input/output interface provided on a firstsilicon substrate member and configured for a predefined data rate andprotocol. The device has a first input/output block provided on thefirst silicon substrate member and coupled to the first datainput/output interface. In an example, the first input/output blockcomprises a SerDes block, a CDR block, a compensation block, and anequalizer block, among others. The device has a first signal processingblock also provided on the first silicon substrate member and coupled tothe first input/output block. In an example, the first signal processingblock is configured to couple with the first input/output block using abi-direction bus in an intermediary protocol. Additionally, the deviceincludes a driver module provided on a third silicon substrate memberand coupled to the first signal processing block on the first siliconsubstrate member via PCB traces. In an example, the device has a driverinterface coupled to the driver module and configured to be coupled tothe silicon photonics device. In an example, the driver interface isconfigured to transmit output data in either an amplitude modulationformat or a combination of phase/amplitude modulation format or a phasemodulation format. In an example, the device has a first communicationblock provided on the first silicon substrate member and operablycoupled to the first input/output block, the first signal processingblock, and also coupled to the driver module on the third siliconsubstrate member via PCB traces, among others. The device has a firstcommunication interface coupled to the first communication block. Thedevice has a first control block provided on the first silicon substratemember and coupled to the first communication block. In a specificembodiment, the first control block is configured to receive and sendinstruction(s) in a digital format to the first communication block andis configured to receive and send signals in an analog format tocommunicate with the silicon photonics device.

In an embodiment, the device also includes a second data input/outputinterface provided on a second silicon substrate member and configuredfor a predefined data rate and protocol. The device has a secondinput/output block provided on the second silicon substrate member andcoupled to the second data input/output interface. In an example, thesecond input/output block comprises a SerDes block, a CDR block, acompensation block, and an equalizer block, among others. The devicefurther include a second signal processing block also provided on thesecond silicon substrate member and coupled to the second input/outputblock. In an example, the second signal processing block is configuredto couple with the second input/output block using a bi-direction bus inan intermediary protocol. Additionally, the device has a receiver modulecomprising a TIA block provided on the fourth silicon substrate memberand to be coupled to the silicon photonics device using predefinedmodulation format, and configured to couple with the second signalprocessing block to communicate information to the second input/outputblock for transmission through the second data input/output interface.In an example, the device has a second communication block provided onthe second silicon substrate member and operably coupled to the secondinput/output block, the second signal processing block, and coupled tothe receiver module on the fourth silicon substrate member via PCBtraces, among others. The device has a second communication interfacecoupled to the second communication block. The device has a secondcontrol block provided on the second silicon substrate member andcoupled to the second communication block. In a specific embodiment, thesecond control block is configured to receive and send instruction(s) ina digital format to the second communication block and is configured toreceive and send signals in an analog format to communicate with thesilicon photonics device.

In a specific embodiment, as shown in FIG. 18, the integratedsystem-on-chip device is a four-chip module 1800 including a first chipsubsystem 1810 comprising a first input/output block, a first digitalsignal processing block, a first control block, and a firstcommunication block, and a third chip as a driver module 1830 configuredto couple to the first digital signal processing block on the first chip1810 through PCB traces and further to couple with a silicon photonicsdevice 1850 through an driver interface configured to transmit outputdata in either an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format. Thefour-chip module 1800 also includes a second chip subsystem 1820comprising a second input/output block, a second digital signalprocessing block, a second control block, and a second communicationblock, coupled to a fourth chip as a receiver module 1840 via PCBtrances. Additionally, the receiver module 1840 is configured to coupleto the silicon photonics device 1850 using predefined modulation formatand configured to couple with the second digital signal processing blockto communicate information to the second input/output block fortransmission through the second data input/output interface.

In an example, each of the first chip subsystem 1810 and the second chipsubsystem 1820 further comprises a FEC block, a framing block, aprotocol block, and a redundancy block, among others. The driver module1830 is selected from a current driver in an example or a voltage driverin another example. In yet another example, the driver module 1830 is adifferential driver or the like. In an example, the silicon photonicsdevice 1850 includes a modulator selected from an electro absorptionmodulator (EAM) or electro optic modulator (EOM), or a Mach-Zehndermodulator (MZM). In an example, the amplified modulation format isselected from NRZ format or PAM format. In an example, the phasemodulation format is selected from BPSK or nPSK. In an example, thephase/amplitude modulation is QAM. In an example, the first chipsubsystem 1810 is configured to send control signals from the firstcontrol block to the silicon photonics device and receive feedbacksignals from the silicon photonics device 1850. In an example, thesecond chip subsystem 1820 is also configured to send control signalsfrom the first control block to the silicon photonics device and receivefeedback signals from the silicon photonics device 1850. In an example,the silicon photonics device 1850 is configured to convert the outputdata into an output transport data in a WDM signal. In an example, thefirst control block in the first chip subsystem 1810 is configured toinitiate a laser bias or a modulator bias as control signals. In anexample, the first control block is configured for laser bias controland power control of the silicon photonics device 1850. In an example,the first control block is configured with a thermal tuning or carriertuning device each of which is configured on the silicon photonicsdevice 1850. In an example, the first input/output block includes aSerDes block configured to convert a first data stream of N into asecond data stream of M. In an example, the second control block in thesecond chip subsystem 1820 is configured to initiate a laser bias or amodulator bias as control signals. In an example, the second controlblock is configured for laser bias control and power control of thesilicon photonics device 1850. In an example, the second control blockis configured with a thermal tuning or carrier tuning device each ofwhich is configured on the silicon photonics device 1850.

FIG. 19 is a simplified diagram of is a simplified block diagram of analternative multi-chip module for silicon photonics, having a separatedriver module coupled to separate a process/control module and aseparate integrated receive and process/control module according to analternative embodiment of the present invention. This diagram is merelyan example, which should not unduly limit the scope of the claims. Oneof ordinary skill in the art would recognize many variations,alternatives, and modifications. As shown, the present inventionincludes an integrated system-on-chip device, or simply called “device”hereafter, configured on three separate silicon substrate members. Thedevice has a first data input/output interface provided on a firstsilicon substrate member and configured for a predefined data rate andprotocol. The device has a first input/output block provided on thefirst silicon substrate member and coupled to the first datainput/output interface. In an example, the first input/output blockcomprises a SerDes block, a CDR block, a compensation block, and anequalizer block, among others. The device has a first signal processingblock also provided on the first silicon substrate member and coupled tothe first input/output block. In an example, the first signal processingblock is configured to couple with the first input/output block using abi-direction bus in an intermediary protocol. Additionally, the deviceincludes a driver module provided on a third silicon substrate memberand coupled to the first signal processing block on the first siliconsubstrate member via PCB traces. In an example, the device has a driverinterface coupled to the driver module and configured to be coupled tothe silicon photonics device. In an example, the driver interface isconfigured to transmit output data in either an amplitude modulationformat or a combination of phase/amplitude modulation format or a phasemodulation format. In an example, the device has a first communicationblock provided on the first silicon substrate member and operablycoupled to the first input/output block, the first signal processingblock, and also coupled to the driver module on the third siliconsubstrate member via PCB traces, among others. The device has a firstcommunication interface coupled to the first communication block. Thedevice has a first control block provided on the first silicon substratemember and coupled to the first communication block. In a specificembodiment, the first control block is configured to receive and sendinstruction(s) in a digital format to the first communication block andis configured to receive and send signals in an analog format tocommunicate with the silicon photonics device.

In an embodiment, the device also includes a second data input/outputinterface provided on a second silicon substrate member and configuredfor a predefined data rate and protocol. The device has a secondinput/output block provided on the second silicon substrate member andcoupled to the second data input/output interface. In an example, thesecond input/output block comprises a SerDes block, a CDR block, acompensation block, and an equalizer block, among others. The devicefurther include a second signal processing block also provided on thesecond silicon substrate member and coupled to the second input/outputblock. In an example, the second signal processing block is configuredto couple with the second input/output block using a bi-direction bus inan intermediary protocol. Additionally, the device has a receiver modulecomprising a TIA block provided on the same second silicon substratemember and to be coupled to the silicon photonics device usingpredefined modulation format, and configured to couple with the secondsignal processing block to communicate information to the secondinput/output block for transmission through the second data input/outputinterface. In an example, the device has a second communication blockprovided on the second silicon substrate member and operably coupled tothe second input/output block, the second signal processing block, andthe receiver module, among others. The device has a second communicationinterface coupled to the second communication block. The device has asecond control block provided on the second silicon substrate member andcoupled to the second communication block. In a specific embodiment, thesecond control block is configured to receive and send instruction(s) ina digital format to the second communication block and is configured toreceive and send signals in an analog format to communicate with thesilicon photonics device.

In a specific embodiment, as shown in FIG. 19, the integratedsystem-on-chip device is a three-chip module 1900 including a first chipsubsystem 1910 comprising a first input/output block, a first digitalsignal processing block, a first control block, and a firstcommunication block. The first chip 1910 is configured to couple to athird chip 1930. The third chip 1930 is a driver module configured tocouple to the first digital signal processing block on the first chip1910 through PCB traces and further to couple with a silicon photonicsdevice 1940 through an driver interface configured to transmit outputdata in either an amplitude modulation format or a combination ofphase/amplitude modulation format or a phase modulation format. Thethree-chip module 1900 also includes a separate second chip subsystem1920 comprising a second input/output block, a second digital signalprocessing block, a second control block, a second communication block,and a receiver module. Additionally, the receiver module is configuredto couple to the second digital signal processing block via in-substrateuni-directional multi-lane bus and also couple to the silicon photonicsdevice 1940 using predefined modulation format and configured to couplewith the second digital signal processing block to communicateinformation to the second input/output block for transmission throughthe second data input/output interface.

In an example, each of the first chip subsystem 1910 and the second chipsubsystem 1920 further comprises a FEC block, a framing block, aprotocol block, and a redundancy block, among others. The third chip orthe driver module 1930 is selected from a current driver in an exampleor a voltage driver in another example. In yet another example, thedriver module 1930 is a differential driver or the like. In an example,the silicon photonics device 1940 includes a modulator selected from anelectro absorption modulator (EAM) or electro optic modulator (EOM), ora Mach-Zehnder modulator (MZM). In an example, the amplified modulationformat is selected from NRZ format or PAM format. In an example, thephase modulation format is selected from BPSK or nPSK. In an example,the phase/amplitude modulation is QAM. In an example, the first chipsubsystem 1910 is configured to send control signals from the firstcontrol block to the silicon photonics device and receive feedbacksignals from the silicon photonics device 1940. In an example, thesecond chip subsystem 1820 is also configured to send control signalsfrom the first control block to the silicon photonics device and receivefeedback signals from the silicon photonics device 1940. In an example,the silicon photonics device 1940 is configured to convert the outputdata into an output transport data in a WDM signal. In an example, thefirst control block in the first chip subsystem 1910 is configured toinitiate a laser bias or a modulator bias as control signals. In anexample, the first control block is configured for laser bias controland power control of the silicon photonics device 1940. In an example,the first control block is configured with a thermal tuning or carriertuning device each of which is configured on the silicon photonicsdevice 1940. In an example, the first input/output block includes aSerDes block configured to convert a first data stream of N into asecond data stream of M. In an example, the second control block isconfigured for laser bias control and power control of the siliconphotonics device 1940. In an example, the second control block isconfigured with a thermal tuning or carrier tuning device each of whichis configured on the silicon photonics device 1940.

While the above is a full description of the specific embodiments,various modifications, alternative constructions and equivalents may beused. Therefore, the above description and illustrations should not betaken as limiting the scope of the present invention which is defined bythe appended claims.

What is claimed is:
 1. An integrated system-on-chip device, the devicecomprising: a silicon substrate member; a data input/output interfaceprovided on the silicon substrate member and configured for a predefineddata rate and protocol; an input/output block provided on the siliconsubstrate member and coupled to the data input/output interface, theinput/output block comprising a SerDes block, a CDR block, acompensation block, and an equalizer block; a signal processing blockprovided on the silicon substrate member and coupled to the input/outputblock using a bi-direction bus in an intermediary protocol; a drivermodule provided on the silicon substrate member and coupled to thesignal processing block using a uni-directional multi-lane bus; a driverinterface provided on the silicon substrate member and coupled to thedriver module and configured to be coupled to a silicon photonicsdevice, the driver interface being configured to transmit output data inan amplitude modulation format; a receiver module comprising a TIA blockprovided on the silicon substrate member and to be coupled to thesilicon photonics device using predefined modulation format, andconfigured to the signal processing block to communicate information tothe input/output block for transmission through the data input/outputinterface; a laser coupled to the silicon photonics device; acommunication block provided on the silicon substrate member andoperably coupled to the input/output block, the signal processing block,the driver module, and the receiver module; a communication interfacecoupled to the communication block; and a control block provided on thesilicon substrate member and coupled to the communication block, thecontrol block being configured to receive and send instruction(s) in adigital format to the communication block and being configured toreceive and send signals in an analog format to communicate with thesilicon photonics device; and wherein the amplified modulation format isa PAM format.
 2. The device of claim 1 wherein the signal processingblock comprises a FEC block, a digital signal processing block, aframing block, a protocol block, and a redundancy block.
 3. The deviceof claim 1 wherein the driver module is selected from a current drive ora voltage driver.
 4. The device of claim 1 wherein the driver module isa differential driver.
 5. The device of claim 1 wherein the siliconphotonic device is configured to convert the output data into an outputtransport data in a WDM signal.
 6. The device of claim 1 wherein thecontrol block is configured to initiate a laser bias or a modulatorbias.
 7. The device of claim 1 wherein the control block is configuredfor laser bias and power control of the silicon photonics device.
 8. Thedevice of claim 1 wherein the control block is configured with a thermaltuning or carrier tuning device each of which is configured on thesilicon photonics device.
 9. The device of claim 1 wherein the SerDesblock is configured to convert a first data stream of N into a seconddata stream of M.
 10. An integrated multi-chip device, the devicecomprising: a first silicon substrate member; a second silicon substratemember; a third silicon substrate member; a data input/output interfaceprovided on the first silicon substrate member and configured for apredefined data rate and protocol; an input/output block provided on thefirst silicon substrate member and coupled to the data input/outputinterface, the input/output block comprising a SerDes block, a CDRblock, a compensation block, and an equalizer block; a signal processingblock provided on the first silicon substrate member and coupled to theinput/output block using a bi-direction bus in an intermediary protocol;a driver module provided on the second silicon substrate member andcoupled to the signal processing block using a uni-directionalmulti-lane bus through PCB traces; a driver interface coupled to thedriver module and configured to be coupled to a silicon photonicsdevice, the driver interface being configured to transmit output data anamplitude modulation format; a receiver module comprising a TIA blockprovided on the third silicon substrate member and to be coupled to thesilicon photonics device using predefined modulation format, and coupledto the signal processing block using a uni-directional multi-lane busthrough PCB traces to communicate information to the input/output blockfor transmission through the data input/output interface; a laser devicecoupled to the silicon photonics device; a communication block providedon the first silicon substrate member and directly coupled to theinput/output block, the signal processing block, and operably coupled tothe driver module and the receiver module; a communication interfacecoupled to the communication block; and a control block provided on thefirst silicon substrate member and coupled to the communication block,the control block being configured to receive and send instruction(s) ina digital format to the communication block and being configured toreceive and send signals in an analog format to communicate with thesilicon photonics device via the communication interface; and whereinthe amplified modulation format is a PAM format.
 11. The device of claim10 wherein the signal processing block comprises a FEC block, a digitalsignal processing block, a framing block, a protocol block, and aredundancy block.
 12. The device of claim 10 wherein the driver moduleis selected from a current driver or a voltage driver.
 13. The device ofclaim 10 wherein the driver module is a differential driver.
 14. Thedevice of claim 10 wherein the silicon photonic device is configured toconvert the output data into an output transport data in a WDM signal.15. The device of claim 10 wherein the control block is configured toinitiate a laser bias or a modulator bias.
 16. The device of claim 10wherein the control block is configured for laser bias and power controlof the silicon photonics device.
 17. The device of claim 10 wherein thecontrol block is configured with a thermal tuning or carrier tuningdevice each of which is configured on the silicon photonics device. 18.The device of claim 10 wherein the SerDes block is configured to converta first data stream of N into a second data stream of M.
 19. Anintegrated multi-chip device, the device comprising: a first siliconsubstrate member; a second silicon substrate member; a data input/outputinterface provided on the first silicon substrate member and configuredfor a predefined data rate and protocol; an input/output block providedon the first silicon substrate member and coupled to the datainput/output interface, the input/output block comprising a SerDesblock, a CDR block, a compensation block, and an equalizer block; asignal processing block provided on the first silicon substrate memberand coupled to the input/output block using a bi-direction bus in anintermediary protocol; a driver module provided on the second siliconsubstrate member and coupled to the signal processing block using auni-directional multi-lane bus through PCB traces; a driver interfacecoupled to the driver module and configured to be coupled to a siliconphotonics device, the driver interface being configured to transmitoutput data in an amplitude modulation format, the amplitude modulationformation being a PAM format; a receiver module comprising a TIA blockprovided on the first silicon substrate member and to be coupled to thesilicon photonics device using predefined modulation format, and coupledto the signal processing block to communicate information to theinput/output block for transmission through the data input/outputinterface; a laser diode device is coupled of the silicon photonicsdevice; a communication block provided on the first silicon substratemember and directly coupled to the input/output block, the signalprocessing block, and operably coupled to the driver module through PCBtrances and to the receiver module using a uni-directional multi-lanebus; a communication interface coupled to the communication block; acontrol block provided on the first silicon substrate member and coupledto the communication block, the control block being configured toreceive and send instruction(s) in a digital format to the communicationblock and being configured to receive and send signals in an analogformat to communicate with the silicon photonics device via thecommunication interface.
 20. An integrated multi-chip device, the devicecomprising: a first silicon substrate member; a second silicon substratemember; a first data input/output interface provided on the firstsilicon substrate member and configured for a predefined data rate andprotocol; a first input/output block provided on the first siliconsubstrate member and coupled to the first data input/output interface,the first input/output block comprising a SerDes block, a CDR block, acompensation block, and an equalizer block; a first signal processingblock provided on the first silicon substrate member and coupled to thefirst input/output block using a bi-direction bus in an intermediaryprotocol; a receiver module comprising a TIA block provided on the firstsilicon substrate member and to be coupled to a silicon photonics deviceusing predefined modulation format, and coupled to the first signalprocessing block using a uni-directional bus on the first siliconsubstrate member to communicate information to the first input/outputblock for transmission through the first data input/output interface; afirst communication block provided on the first silicon substrate memberand directly coupled to the first input/output block, the first signalprocessing block, and operably coupled to the receiver module; a firstcommunication interface coupled to the first communication block; afirst control block provided on the first silicon substrate member andcoupled to the first communication block, the first control block beingconfigured to receive and send instruction(s) in a digital format to thefirst communication block and being configured to receive and sendsignals in an analog format to communicate with the silicon photonicsdevice via the first communication interface; a second data input/outputinterface provided on the second silicon substrate member and configuredfor a predefined data rate and protocol; a second input/output blockprovided on the second silicon substrate member and coupled to thesecond data input/output interface, the second input/output blockcomprising a SerDes block, a CDR block, a compensation block, and anequalizer block; a second signal processing block provided on the secondsilicon substrate member and coupled to the second input/output blockusing a bi-direction bus in an intermediary protocol; a driver moduleprovided on the second silicon substrate member and coupled to thesecond signal processing block using a uni-directional multi-lane bus onthe second silicon substrate; a driver interface coupled to the drivermodule and configured to be coupled to a silicon photonics device, thedriver interface being configured to transmit output data in anamplitude modulation format, the amplitude modulation formation being aPAM format; a laser device being coupled to the silicon photonicsdevice; a second communication block provided on the second siliconsubstrate member and directly coupled to the second input/output block,the second signal processing block, and operably coupled to the drivermodule; a second communication interface coupled to the secondcommunication block; and a second control block provided on the secondsilicon substrate member and coupled to the second communication block,the second control block being configured to receive and sendinstruction(s) in a digital format to the second communication block andbeing configured to receive and send signals in an analog format tocommunicate with the silicon photonics device via the secondcommunication interface.
 21. An integrated multi-chip device, the devicecomprising: a first silicon substrate member; a second silicon substratemember; a third silicon substrate member; a fourth silicon substratemember; a first data input/output interface provided on the firstsilicon substrate member and configured for a predefined data rate andprotocol; a first input/output block provided on the first siliconsubstrate member and coupled to the first data input/output interface,the first input/output block comprising a SerDes block, a CDR block, acompensation block, and an equalizer block; a first signal processingblock provided on the first silicon substrate member and coupled to thefirst input/output block using a bi-direction bus in an intermediaryprotocol; a driver module provided on the third silicon substrate memberand coupled to the first signal processing block using a uni-directionalmulti-lane bus through PCB traces; a driver interface coupled to thedriver module and configured to be coupled to a silicon photonics deviceand to transmit output data in an amplitude modulation format, theamplitude modulation formation being a PAM format; a first communicationblock provided on the first silicon substrate member and directlycoupled to the first input/output block, the first signal processingblock, and operably coupled to the driver module; a first communicationinterface coupled to the first communication block; a first controlblock provided on the first silicon substrate member and coupled to thefirst communication block, the first control block being configured toreceive and send instruction(s) in a digital format to the firstcommunication block and being configured to receive and send signals inan analog format to communicate with the silicon photonics device viathe first communication interface; a second data input/output interfaceprovided on the second silicon substrate member and configured for apredefined data rate and protocol; a second input/output block providedon the second silicon substrate member and coupled to the second datainput/output interface, the second input/output block comprising aSerDes block, a CDR block, a compensation block, and an equalizer block;a second signal processing block provided on the second siliconsubstrate member and coupled to the second input/output block using abi-direction bus in an intermediary protocol; a receiver modulecomprising a TIA block provided on the fourth silicon substrate memberand to be coupled to the silicon photonics device using predefinedmodulation format, and coupled to the second signal processing blockusing a uni-directional multi-lane bus through PCB traces to communicateinformation to the second input/output block for transmission throughthe second data input/output interface; a second communication blockprovided on the second silicon substrate member and directly coupled tothe second input/output block, the second signal processing block, andoperably coupled to the receiver module; a second communicationinterface coupled to the second communication block; and a secondcontrol block provided on the second silicon substrate member andcoupled to the second communication block, the second control blockbeing configured to receive and send instruction(s) in a digital formatto the second communication block and being configured to receive andsend signals in an analog format to communicate with the siliconphotonics device via the second communication interface.
 22. Anintegrated multi-chip device, the device comprising: a first siliconsubstrate member; a second silicon substrate member; a third siliconsubstrate member; a first data input/output interface provided on thefirst silicon substrate member and configured for a predefined data rateand protocol; a first input/output block provided on the first siliconsubstrate member and coupled to the first data input/output interface,the first input/output block comprising a SerDes block, a CDR block, acompensation block, and an equalizer block; a first signal processingblock provided on the first silicon substrate member and coupled to thefirst input/output block using a bi-direction bus in an intermediaryprotocol; a driver module provided on the third silicon substrate memberand coupled to the first signal processing block using a uni-directionalmulti-lane bus through PCB traces; a driver interface coupled to thedriver module and configured to be coupled to a silicon photonics deviceand to transmit output data in either an amplitude modulation format,the amplitude modulation formation is a PAM format; a firstcommunication block provided on the first silicon substrate member anddirectly coupled to the first input/output block, the first signalprocessing block, and operably coupled to the driver module; a firstcommunication interface coupled to the first communication block; afirst control block provided on the first silicon substrate member andcoupled to the first communication block, the first control block beingconfigured to receive and send instruction(s) in a digital format to thefirst communication block and being configured to receive and sendsignals in an analog format to communicate with the silicon photonicsdevice via the first communication interface; a second data input/outputinterface provided on the second silicon substrate member and configuredfor a predefined data rate and protocol; a second input/output blockprovided on the second silicon substrate member and coupled to thesecond data input/output interface, the second input/output blockcomprising a SerDes block, a CDR block, a compensation block, and anequalizer block; a second signal processing block provided on the secondsilicon substrate member and coupled to the second input/output blockusing a bi-direction bus in an intermediary protocol; a receiver modulecomprising a TIA block provided on the second silicon substrate memberand to be coupled to the silicon photonics device using predefinedmodulation format, and coupled to the second signal processing blockusing a uni-directional multi-lane bus on the second silicon substratemember to communicate information to the second input/output block fortransmission through the second data input/output interface; a secondcommunication block provided on the second silicon substrate member anddirectly coupled to the second input/output block, the second signalprocessing block, and operably coupled to the receiver module; a secondcommunication interface coupled to the second communication block; and asecond control block provided on the second silicon substrate member andcoupled to the second communication block, the second control blockbeing configured to receive and send instruction(s) in a digital formatto the second communication block and being configured to receive andsend signals in an analog format to communicate with the siliconphotonics device via the second communication interface.